Stochastic Finite Element Modeling in Electronic Packaging
$262.04
- Hardcover
288 pages
- Release Date
13 January 2026
Summary
An expert integration of digital twin technology and advanced simulation methods for the design and optimization of electronic packaging systems
In Stochastic Finite Element Modeling in Electronic Packaging, distinguished researcher Liu Chu delivers an expert discussion of the latest advanced numerical methods and modeling techniques specific to electronic packaging. The book supplements its explanations with original MATLAB and ANSYS (APDL) code that can be …
Book Details
| ISBN-13: | 9781394352944 |
|---|---|
| ISBN-10: | 1394352948 |
| Author: | Liu Chu |
| Publisher: | John Wiley & Sons Inc |
| Imprint: | Wiley-IEEE Press |
| Format: | Hardcover |
| Number of Pages: | 288 |
| Release Date: | 13 January 2026 |
| Weight: | 532g |
| Dimensions: | 238mm x 158mm |
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About The Author
Liu Chu
Liu Chu, PhD, is an Associate Professor at the School of Electronic and Information Engineering, Tongji University. Her research focuses on uncertainty quantification in stochastic defects, numerical simulations for electronic packaging, and the development of advanced computational mechanics methods.
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