
Electromigration in Metals
fundamentals to nano-interconnects
$246.47
- Hardcover
430 pages
 - Release Date
12 May 2022
 
Summary
Electromigration in Metals: A Practical Guide to Reliability
Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids.
Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well a…
Book Details
| ISBN-13: | 9781107032385 | 
|---|---|
| ISBN-10: | 1107032385 | 
| Author: | Chao-Kun Hu, Martin Gall, Valeriy Sukharev, Paul S. Ho | 
| Publisher: | Cambridge University Press | 
| Imprint: | Cambridge University Press | 
| Format: | Hardcover | 
| Number of Pages: | 430 | 
| Release Date: | 12 May 2022 | 
| Weight: | 980g | 
| Dimensions: | 250mm x 174mm x 24mm | 
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What They're Saying
Critics Review
‘… useful for graduate students in materials science and mechanical or electrical engineering … Recommended.’ J. Lambropoulos, Choice
About The Author
Chao-Kun Hu
Paul Ho is Professor Emeritus in the Department of Mechanical Engineering and the Texas Materials Institute at the University of Texas at Austin. He has received research awards from the Electrochemical Society, IEEE, IITC and Semiconductor Industry Association, among others.
Chao-Kun Hu has recently retired as a Research Staff Member in the Reliability Department at the T.J. Watson Research Center of IBM. He received IBM Corporate awards, IEEE Cledo Brunetti award, EDS Recognition and IITC Best Paper awards, and Invention of the Year NY Intellectual Property Law Association.
Martin Gall is the director of the U.S. Operations Reliability Engineering Department at GLOBALFOUNDRIES Inc. He is an IEEE TDMR editor and the recipient of an IEEE IITC Best Paper and SRC Mentor of the Year Award.
Valeriy Sukharev is principal engineer for Calibre Design Solutions, Siemens EDA, Siemens Digital Industries Software. He was a recipient of the 2014 and 2018 Mahboob Khan Outstanding Industry Liaison Award (SRC) and the Best Paper awards from ICCAD 2016, 2019 and 2020.
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